I nā ʻoihana e like me microelectronics, optoelectronics a me biopharmaceuticals,ʻālohilohi annealing(BA), pickling or passivation (AP),ka poni electrolytic (EP)a hoʻohana mau ʻia ka lāʻau lapaʻau lua no nā ʻōnaehana pipeline maʻemaʻe kiʻekiʻe a maʻemaʻe e hoʻouna ana i ka media sensitive a corrosive. Nā huahana i hoʻopau ʻia (VIM+VAR).
A. Electro-Polished (Electro-Polished) i kapa ʻia ʻo EP. Ma o ka electrochemical polishing, hiki ke hoʻomaikaʻi maikaʻi ʻia ka morphology o ka ʻili a me ke ʻano, a hiki ke hoʻemi ʻia ka ʻili maoli i kekahi ʻano. ʻO ka ʻili he kiʻiʻoniʻoni chromium oxide paʻa, mānoanoa, kokoke ka ikehu i ka pae maʻamau o ka alloy, a hoʻemi ʻia ka nui o ka media - kūpono maʻamau no ka papa uila.kinoea maemae loa.
ʻO B. Bright Annealing (Bright Annealing) i kapa ʻia ʻo BA. Kiʻekiʻe-mehana wela lapaʻau i loko o hydrogenation a me ka mokumoku mokuʻāina, ma ka kekahi lima, eliminates kūloko stress, a ma kekahi lima, hana i ka passivation kiʻiʻoniʻoni ma luna o ka ili o ka paipu e hoʻomaikaʻi i ka morphological hale a hoemi i ka ikehu pae, akā, 'aʻole. e hoʻonui i ka ʻinoʻino o ka ʻili - kūpono maʻamau no GN2 , CDA, a me nā kinoea inert hana ʻole.
C. Pickled & Passivated/Chemically Polished (Pickled & Passivated/Chemically Polished) ua kapa ʻia ʻo AP a me CP. ʻO ka pickling a i ʻole ka passivation o ka paipu ʻaʻole ia e hoʻonui i ka roughness o ka ʻili, akā hiki iā ia ke hoʻoneʻe i nā ʻāpana i koe ma luna o ka ʻili a hoʻemi i ka pae ikehu, akā ʻaʻole ia e hōʻemi i ka helu o nā interlayers - hoʻohana pinepine ʻia i nā paipu papa hana.
D. Vacuum secondary dissolution tube maʻemaʻe Vim (Vacuum Induction Melting) + Var (Vacuum ArcRemelting), i kapa ʻia ʻo V + V, he huahana ia na Sumitomo Metal Company. Ua hana hou ʻia ma lalo o nā kūlana arc i loko o kahi mokuʻāina, kahi e hoʻomaikaʻi maikaʻi ai i ka pale ʻana i ka corrosion a me ka ʻili o ka ʻili. Degree - kūpono no nā kinoea uila maʻemaʻe kiʻekiʻe, e like me: BCL3, WF6, CL2, HBr, etc. 
Ka manawa kau: Apr-08-2024